ArmorLED TECHNOLOGY
More Pins, 4–10x Higher Thrust
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M2/M4 LEDs -
GOE Process -
SMT Process -
PCB Pad Design
Armor-Like Protection, Built for Reliability
Enhanced protection helps reduce LED damage and long-term maintenance pressure, especially during transport, installation, and repeated handling.
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8-Pin DesignM2/M4 LEDs use 8 or more pins to increase soldering area and bonding strength.
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3–5x Soldering StrengthCompared with standard LEDs, ArmorLED improves soldering strength for a more secure LED-PCB connection.
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4–10x Higher Push ForceStronger impact resistance helps protect the screen from damage during handling and operation.
GOE Process for a Stronger Structure
The GOE Process precisely fills the gap between the LED and PCB, reinforcing the connection and improving overall display durability.
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Precise Glue ControlAccurate glue amount and placement. -
Gap FillingFills the space between LED and PCB. -
Stronger BondingImproves LED-PCB connection strength. -
Reinforced StructureMakes the display more stable and durable.
Refined SMT Process for Reliable Soldering
INFiLED refines stencil design, reflow soldering temperature control, and high-precision SMT equipment to improve solder joint strength and long-term reliability.
Optimized PCB Pad for Stronger Bonding
PCB Pad design plays a key role in LED soldering quality. ArmorLED optimizes pad size and tolerance to strengthen the bond between the LED and PCB, supporting long-term stability and durability.
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